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Khanna Bond Solder Manufacturers Private Limited

Since its incorporation on 19 Aug 2022, Khanna Bond Solder Manufacturers Private Limited has been active for 4 years. Its CIN is U24100DL2022PTC403365, with registration number 403365. The company is classified as company limited by shares. The declared authorized capital is ₹4.00 crore. It has a paid-up capital totaling ₹3.98 crore.

The company specializes in manufacture of basic chemicals operations. Khanna Bond Solder Manufacturers Private Limited is officially registered in Delhi. It is incorporated at Cb 152, Ring Road Naraina, West Delhi, Delhi, Delhi, India, 110028. It is an active company at present. The Permanent Account Number assigned to the company is AAJCK7343Q. Khanna Bond Solder Manufacturers Private Limited holds the LEI code 894500V2LWPCWV7VKA42. Khanna Bond Solder Manufacturers Private Limited can be contacted at roc.mca@scvandco.com.

Company Overview

CIN
U24100DL2022PTC403365
Date of Incorporation
19/08/2022
Company Status
Active
RoC
Delhi
Registration Number
403365
Balance sheet date
31/03/2025
Company Category
Company limited by shares
Company Sub Category
Non-government company
Listed in Stock Exchange
No
Class of Company
Private Limited Company
LEI Number
894500V2LWPCWV7VKA42
LEI Status
Issued
Authorized Capital
₹4,00,00,000.00
Paid up Capital
₹3,98,00,000.00
Activity
Manufacture of basic chemicals
E-mail
roc.mca@scvandco.com
PAN
AAJCK7343Q

GST Numbers

StateGST NumberStatus
Delhi07AAJCK7343Q1ZSActive
Karnataka29AAJCK7343Q1ZMActive
Maharashtra27AAJCK7343Q1ZQActive
Uttarakhand05AAJCK7343Q1ZWActive
Uttar Pradesh09AAJCK7343Q1ZOActive

Directors

AppointmentDirector nameDINDesignation
20/08/2022Virendra Kumar Khanna00021001DirectorView other directorships
20/08/2022Sushil Kumar Khanna00021045DirectorView other directorships
15/03/2024Amit Khanna10525439DirectorView other directorships
15/03/2024Tanvi Khanna10542364DirectorView other directorships

Business Network

CompanyDirectorNot on WeeDooBoard seatKey rolePast seatOwnership

Directors 4

Latest Documents

Category:
DateTitleSize
22/10/2024
Form MGT-7A-22102024_signed
-
21/10/2024
Form AOC-4-21102024
-

Charges

SRNDateAmountHolder
AB542747701/07/2025₹40,00,00,000.00The Hongkong And Shanghai Banking Corporation Limited

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Address

Cb 152, Ring Road Naraina, West Delhi, Delhi, Delhi, India, 110028

Frequently Asked Questions

What is the incorporation date of Khanna Bond Solder Manufacturers Private Limited?
The incorporation date of Khanna Bond Solder Manufacturers Private Limited is 19/08/2022.
What is the authorized share capital and paid-up capital of Khanna Bond Solder Manufacturers Private Limited?
The authorized share capital of Khanna Bond Solder Manufacturers Private Limited is ₹4,00,00,000.00. The paid-up capital is ₹3,98,00,000.00.
Who are the current board members & directors of Khanna Bond Solder Manufacturers Private Limited?

The current board member of Khanna Bond Solder Manufacturers Private Limited are:

  • Virendra Kumar Khanna
  • Sushil Kumar Khanna
  • Amit Khanna
  • Tanvi Khanna
What is the registered address of Khanna Bond Solder Manufacturers Private Limited?
The registered address of Khanna Bond Solder Manufacturers Private Limited is Cb 152, Ring Road Naraina, West Delhi, Delhi, Delhi, India, 110028.
What is the Corporate Identification Number of Khanna Bond Solder Manufacturers Private Limited?
The Corporate Identification Number of Khanna Bond Solder Manufacturers Private Limited is U24100DL2022PTC403365.